John Collison: belief

Transcript context

…There are probably some important alignment requirement there. I think I remember that being quite like the classic manufacturing throughput problem. I think they've done a lot of work on optimizing that. They tape that, so then you just produce hundreds of copies of your chip. You have to test it because there are defects. You typically, I think the average rates really depends on process and so on, but small single digit number of defects per chip. You test the chip and see whether it has any defects in it. Many chips are designed to be able to tolerate a few defects, and so you need to configure it to tolerate the defects. Now you have a die that by itself works. Then you need to package it. You put it in a package together with memories, typically that's the HBM, and then maybe you escape the wires to connect to other chips.…

Stored transcript either side of the excerpt. The highlighted words are the published quote; the surrounding text is unedited source, never generated.